ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,380, issued on July 28, was assigned to Sumitomo Electric Device Innovations Inc. (Yokohama, Japan).

"Matching circuit board and semiconductor device" was invented by Ikuo Nakashima (Yokohama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A matching circuit board includes a first substrate, a second substrate, and a third substrate. The first substrate includes a first insulator, a first metal pattern, and first conductive vias. The second substrate includes a second insulator, a second metal pattern, and second conductive vias. The third substrate includes a third insulator and a third metal pattern. A capacitor is constituted by the first m...