MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202647088320 A) filed by Qualcomm Incorporated on July 20, 2026, for Signaling For Center Frequency Ambiguity ... Read More
MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202647088321 A) filed by Nokia Technologies Oy on July 20, 2026, for Signal Phase Transitions For Transmission... Read More
MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202647088322 A) filed by Qualcomm Incorporated on July 20, 2026, for Multimodal Sensor-Agnostic Localization U... Read More
MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202647088323 A) filed by Toray Industries, Inc. on July 20, 2026, for Filter Medium For Air Filter, Manufactur... Read More
MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202647088329 A) filed by Google LLC on July 20, 2026, for Compute Budget For Generative Models. Inventors inc... Read More
MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202647088336 A) filed by Resonac Corporation on July 20, 2026, for Chloroprene Latex, Rubber Asphalt Emulsion,... Read More
MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202647088343 A) filed by Seiwa Kasei Company, Limited on July 20, 2026, for Amino Acid Derivative Composition,... Read More
MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202647088345 A) filed by Dai Nippon Printing Co. , Ltd. on July 20, 2026, for Retardation Film, Elliptically P... Read More
MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202647088348 A) filed by Qualcomm Incorporated on July 20, 2026, for Buried Bump Structure. Inventors include... Read More
MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202647088349 A) filed by Qualcomm Incorporated on July 20, 2026, for Integrated Device Comprising Metallizatio... Read More