Intellectual Property India Publishes Patent Application for Integrated Device Comprising Metallization Portion With Step Pad Interconnects

MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202647088349 A) filed by Qualcomm Incorporated on July 20, 2026, for Integrated Device Comprising Metallization Portion With Step Pad Interconnects.

Inventors include Sun, Yangyang; Zhang, Xuefeng; and Chen, Jun.

The application for the patent was published on July 24, 2026, under issue no. 30/2026.

Abstract: An integrated device comprising a die substrate; a die interconnection coupled to the die substrate; an encapsulation layer coupled to a side surface of the die substrate and a side surface of the die interconnection; a plurality of pad interconnects coupled to the die interconnection; a passivation layer coupled to the die interconnection; and...