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US Patent Issued to Intel on July 21 for "Top side frame stiffener structure for a printed circuit board (PCB) stack" (Oregon Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,119, issued on July 21, was assigned to Intel Corp. (Santa Clara, Calif.). "Top side frame stiffener structure for a printed circuit board ... Read More


US Patent Issued on July 21 for "Lens for retrofitting a lighting system with LED lights" (Iowa Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,120, issued on July 21. "Lens for retrofitting a lighting system with LED lights" was invented by Myron Gordin (Osklaoosa, Iowa), Luke C. M... Read More


US Patent Issued to LG INNOTEK on July 21 for "Camera module" (South Korean Inventor)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,121, issued on July 21, was assigned to LG INNOTEK Co. LTD. (Seoul, South Korea). "Camera module" was invented by Sang Yeal Han (Seoul, Sou... Read More


US Patent Issued to Nano and Advanced Materials Institute on July 21 for "Milliwave RF device based on flexible and deformable materials with low dielectric constant and dielectric loss" (Chinese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,122, issued on July 21, was assigned to Nano and Advanced Materials Institute Ltd. (Hong Kong, Hong Kong). "Milliwave RF device based on fl... Read More


US Patent Issued to SAMSUNG ELECTRONICS on July 21 for "Display module accounting for ESD phenomenon, and electronic device comprising display module" (South Korean Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,123, issued on July 21, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Display module accounting for ESD phenomenon... Read More


US Patent Issued to ZF Friedrichshafen on July 21 for "High-current element for high-current printed circuit boards" (German, Indian Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,124, issued on July 21, was assigned to ZF Friedrichshafen AG (Friedrichshafen, Germany). "High-current element for high-current printed ci... Read More


US Patent Issued to Mettler-Toledo on July 21 for "Printed circuit board assembly" (Swiss Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,125, issued on July 21, was assigned to Mettler-Toledo GmbH (Greifensee, Switzerland). "Printed circuit board assembly" was invented by Wen... Read More


US Patent Issued to Aptiv Technologies on July 21 for "PCB for an IC chip with D-PHY function and C-PHY function and an PCB assembly including the IC chip" (German Inventor)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,126, issued on July 21, was assigned to Aptiv Technologies AG (Schaffhausen, Switzerland). "PCB for an IC chip with D-PHY function and C-PH... Read More


US Patent Issued to CANON on July 21 for "Printed wiring board, printed circuit board, electronic equipment, and head mounted display" (Japanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,127, issued on July 21, was assigned to CANON K.K. (Tokyo). "Printed wiring board, printed circuit board, electronic equipment, and head mo... Read More


US Patent Issued to SUMITOMO ELECTRIC INDUSTRIES, SUMITOMO ELECTRIC PRINTED CIRCUITS on July 21 for "Substrate for printed circuit board and printed circuit board" (Japanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,128, issued on July 21, was assigned to SUMITOMO ELECTRIC INDUSTRIES LTD. (Osaka, Japan) and SUMITOMO ELECTRIC PRINTED CIRCUITS INC. (Shiga,... Read More