US Patent Issued to Intel on July 21 for "Top side frame stiffener structure for a printed circuit board (PCB) stack" (Oregon Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,119, issued on July 21, was assigned to Intel Corp. (Santa Clara, Calif.).

"Top side frame stiffener structure for a printed circuit board (PCB) stack" was invented by Juha T. Paavola (Hillsboro, Ore.), Kari Pekka Johannes Mansukoski (Hillsboro, Ore.), Sami M. Heinisuo (Dallas, Ore.) and Cody K. Hougnon (Hillsboro, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A top side frame stiffener structure for a printed circuit board (PCB) stack. The structure is placed between a cooling component and a backing plate, in an area surrounding a substrate package. The structure does not cause the overall height of the PCB stack to increase."

The patent wa...