ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,599, issued on June 23, was assigned to CHANGXIN MEMORY TECHNOLOGIES INC. (Hefei City, China). "Method to insulate contact plug with silico... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,600, issued on June 23, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor memory device having epitaxial... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,601, issued on June 23, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor memory device" was invented by... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,602, issued on June 23, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor memory device" was invented by... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,603, issued on June 23, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor device with linered contact and me... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,604, issued on June 23, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor device and manufacturing metho... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,605, issued on June 23, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor structure using lining layer to pr... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,606, issued on June 23, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-Si, South Korea). "Semiconductor memory device and method for f... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,607, issued on June 23, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor device" was invented by Jun... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,608, issued on June 23, was assigned to CHANGXIN MEMORY TECHNOLOGIES INC. (Hefei City, China). "Semiconductor structure, and method for for... Read More