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US Patent Issued to Korea Photonics Technology Institute on Sept. 8 for "Stretchable substrate, and method for manufacturing stretchable substrate" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,091, issued on Sept. 8, was assigned to Korea Photonics Technology Institute (Gwangju, South Korea). "Stretchable substrate, and method for... और पढ़ें


US Patent Issued to Dai Nippon Printing on Sept. 8 for "Wiring board" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,092, issued on Sept. 8, was assigned to Dai Nippon Printing Co. Ltd. (Tokyo). "Wiring board" was invented by Hiroki Furushou (Tokyo), Atsuk... और पढ़ें


US Patent Issued to ADVANCED CHIP AND CIRCUIT MATERIALS on Sept. 8 for "Use of inorganic thin non-woven dielectrics in printed circuit boards" (California Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,093, issued on Sept. 8, was assigned to ADVANCED CHIP AND CIRCUIT MATERIALS INC. (San Jose, Calif.). "Use of inorganic thin non-woven diele... और पढ़ें


US Patent Issued to SAMSUNG ELECTRO-MECHANICS on Sept. 8 for "Printed circuit board" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,094, issued on Sept. 8, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea). "Printed circuit board" was invented by... और पढ़ें


US Patent Issued to QUALCOMM on Sept. 8 for "Package comprising a substrate with an interconnect block" (California Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,095, issued on Sept. 8, was assigned to QUALCOMM Inc. (San Diego). "Package comprising a substrate with an interconnect block" was invented... और पढ़ें


US Patent Issued to MEKTEC on Sept. 8 for "Flexible printed board and flexible printed board connection structure" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,096, issued on Sept. 8, was assigned to MEKTEC Corp. (Tokyo). "Flexible printed board and flexible printed board connection structure" was ... और पढ़ें


US Patent Issued to WUS PRINTED CIRCUIT (KUNSHAN) on Sept. 8 for "Circuit board and fabrication method thereof, and electronic device" (Chinese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,098, issued on Sept. 8, was assigned to WUS PRINTED CIRCUIT (KUNSHAN) Co. LTD. (Suzhou, China). "Circuit board and fabrication method there... और पढ़ें


US Patent Issued to Raytheon on Sept. 8 for "Electronics packaging for moving platforms" (Minnesota Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,099, issued on Sept. 8, was assigned to Raytheon Co. (Arlington, Va.). "Electronics packaging for moving platforms" was invented by Gary Wi... और पढ़ें


US Patent Issued to Solidigm on Sept. 8 for "Reducing printed circuit board area for single-sided printed circuit board" (California Inventor)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,100, issued on Sept. 8, was assigned to Solidigm Inc. (Rancho Cordova, Calif.). "Reducing printed circuit board area for single-sided print... और पढ़ें


US Patent Issued to SUMITOMO ELECTRIC PRINTED CIRCUITS on Sept. 8 for "Printed wiring board" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,101, issued on Sept. 8, was assigned to SUMITOMO ELECTRIC PRINTED CIRCUITS INC. (Shiga, Japan). "Printed wiring board" was invented by Mich... और पढ़ें