US Patent Issued to QUALCOMM on Sept. 8 for "Three-dimensional (3D) integrated circuit (IC) (3DIC) package employing a redistribution layer (RDL) interposer facilitating semiconductor die stacking, and related fabrication methods" (California Inventors)

Posted On: 2026-09-08

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,542, issued on Sept. 8, was assigned to QUALCOMM Inc. (San Diego). "Three-dimensional (3D) integrated circuit (IC) (3DIC) package employing... Read More

US Patent Issued to Hitachi Energy Switzerland on Sept. 8 for "Power semiconductor module and manufacturing method" (Swiss Inventors)

Posted On: 2026-09-08

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ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,543, issued on Sept. 8, was assigned to Hitachi Energy Switzerland AG (Baden, Switzerland). "Power semiconductor module and manufacturing m... Read More

US Patent Issued to Seoul Viosys on Sept. 8 for "Light emitting module including light emitter with shaped P-type semiconductor layer" (South Korean Inventors)

Posted On: 2026-09-08

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ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,544, issued on Sept. 8, was assigned to Seoul Viosys Co. Ltd. (Gyeonggi-do, South Korea). "Light emitting module including light emitter wi... Read More

US Patent Issued to CHANGXIN MEMORY TECHNOLOGIES on Sept. 8 for "Semiconductor package structure and manufacturing method therefor" (Chinese Inventors)

Posted On: 2026-09-08

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ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,545, issued on Sept. 8, was assigned to CHANGXIN MEMORY TECHNOLOGIES INC. (Hefei City, China). "Semiconductor package structure and manufac... Read More

US Patent Issued to SAMSUNG ELECTRONICS on Sept. 8 for "Semiconductor package and method of manufacturing the same" (South Korean Inventors)

Posted On: 2026-09-08

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ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,546, issued on Sept. 8, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package and method of manufact... Read More

US Patent Issued to SAMSUNG ELECTRONICS on Sept. 8 for "Semiconductor package and method of manufacturing the same" (South Korean Inventors)

Posted On: 2026-09-08

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ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,547, issued on Sept. 8, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package and method of manufact... Read More

US Patent Issued to SILICONWARE PRECISION INDUSTRIES on Sept. 8 for "Electronic package and fabricating method thereof" (Taiwanese Inventors)

Posted On: 2026-09-08

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ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,548, issued on Sept. 8, was assigned to SILICONWARE PRECISION INDUSTRIES Co. LTD. (Taichung City, Taiwan). "Electronic package and fabricat... Read More

US Patent Issued to SAMSUNG ELECTRONICS on Sept. 8 for "Semiconductor package" (South Korean Inventors)

Posted On: 2026-09-08

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ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,549, issued on Sept. 8, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor package" was invented by Ky... Read More

US Patent Issued to AUDI on Sept. 8 for "Power electronics arrangement with parallel connected semiconductor switches, power electronics device, motor vehicle, and method for producing a power electronics arrangement" (German Inventor)

Posted On: 2026-09-08

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ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,550, issued on Sept. 8, was assigned to AUDI AG (Ingolstadt, Germany). "Power electronics arrangement with parallel connected semiconductor... Read More

US Patent Issued to Samsung Display on Sept. 8 for "Apparatus for manufacturing display device and method of manufacturing display device" (South Korean Inventors)

Posted On: 2026-09-08

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ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,551, issued on Sept. 8, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea). "Apparatus for manufacturing display device and ... Read More

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US Patent Issued to QUALCOMM on Sept. 8 for "Three-dimensional (3D) integrated circuit (IC) (3DIC) package employing a redistribution layer (RDL) interposer facilitating semiconductor die stacking, and related fabrication methods" (California Inventors)

US Patent Issued to Hitachi Energy Switzerland on Sept. 8 for "Power semiconductor module and manufacturing method" (Swiss Inventors)

US Patent Issued to Seoul Viosys on Sept. 8 for "Light emitting module including light emitter with shaped P-type semiconductor layer" (South Korean Inventors)

US Patent Issued to CHANGXIN MEMORY TECHNOLOGIES on Sept. 8 for "Semiconductor package structure and manufacturing method therefor" (Chinese Inventors)

US Patent Issued to SAMSUNG ELECTRONICS on Sept. 8 for "Semiconductor package and method of manufacturing the same" (South Korean Inventors)

US Patent Issued to SAMSUNG ELECTRONICS on Sept. 8 for "Semiconductor package and method of manufacturing the same" (South Korean Inventors)

US Patent Issued to SILICONWARE PRECISION INDUSTRIES on Sept. 8 for "Electronic package and fabricating method thereof" (Taiwanese Inventors)

US Patent Issued to SAMSUNG ELECTRONICS on Sept. 8 for "Semiconductor package" (South Korean Inventors)

US Patent Issued to AUDI on Sept. 8 for "Power electronics arrangement with parallel connected semiconductor switches, power electronics device, motor vehicle, and method for producing a power electronics arrangement" (German Inventor)

US Patent Issued to Samsung Display on Sept. 8 for "Apparatus for manufacturing display device and method of manufacturing display device" (South Korean Inventors)