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International Patent: KEY GENERATION SYSTEM, KEY GENERATION METHOD, AND NON-TRANSITORY STORAGE MEDIUM

GENEVA, Oct. 30 -- HITACHI, LTD. filed a patent application (JP2026/002628) for “KEY GENERATION SYSTEM, KEY GENERATION METHOD, AND NON-TRANSITORY STORAGE MEDIUM”. With publication no. WO/2026/225042, ... Read More


International Patent: SPECTROSCOPIC MODULE

GENEVA, Oct. 30 -- HAMAMATSU PHOTONICS K.K. filed a patent application (JP2026/002695) for “SPECTROSCOPIC MODULE”. With publication no. WO/2026/225043, here are the other details related to the patent... Read More


International Patent: METHOD FOR RECOVERING METAL COMPONENTS AND ANION COMPONENTS

GENEVA, Oct. 30 -- TOHOKU UNIVERSITY filed a patent application (JP2026/002193) for “METHOD FOR RECOVERING METAL COMPONENTS AND ANION COMPONENTS”. With publication no. WO/2026/225037, here are the oth... Read More


International Patent: SINTER-BONDING MATERIAL AND SEMICONDUCTOR POWER MODULE

GENEVA, Oct. 30 -- HITACHI, LTD. filed a patent application (JP2026/002259) for “SINTER-BONDING MATERIAL AND SEMICONDUCTOR POWER MODULE”. With publication no. WO/2026/225038, here are the other detail... Read More


International Patent: RESISTANCE SPOT-WELDED JOINT

GENEVA, Oct. 30 -- JFE STEEL CORPORATION filed a patent application (JP2026/002275) for “RESISTANCE SPOT-WELDED JOINT”. With publication no. WO/2026/225039, here are the other details related to the p... Read More


International Patent: ULTRASONIC THERAPY DEVICE

GENEVA, Oct. 30 -- SONIRE THERAPEUTICS INC. filed a patent application (JP2026/002133) for “ULTRASONIC THERAPY DEVICE”. With publication no. WO/2026/225033, here are the other details related to the p... Read More


International Patent: HEAT DISSIPATION FIN, COOLING DEVICE, AND SEMICONDUCTOR DEVICE

GENEVA, Oct. 30 -- MITSUBISHI ELECTRIC CORPORATION filed a patent application (JP2026/002171) for “HEAT DISSIPATION FIN, COOLING DEVICE, AND SEMICONDUCTOR DEVICE”. With publication no. WO/2026/225034,... Read More


International Patent: HEAT DISSIPATION FIN, COOLING DEVICE, SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING HEAT DISSIPATION FIN, METHOD FOR MANUFACTURING COOLING DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, JIG, AND IDENTIFICATION DEVICE

GENEVA, Oct. 30 -- MITSUBISHI ELECTRIC CORPORATION filed a patent application (JP2026/002173) for “HEAT DISSIPATION FIN, COOLING DEVICE, SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING HEAT DISSIPATION... Read More


International Patent: BATTERY AND CURRENT COLLECTOR

GENEVA, Oct. 30 -- VEHICLE ENERGY JAPAN INC. filed a patent application (JP2026/002051) for “BATTERY AND CURRENT COLLECTOR”. With publication no. WO/2026/225029, here are the other details related to ... Read More


International Patent: METHOD FOR EVALUATING LIQUID METAL EMBRITTLEMENT SENSITIVITY

GENEVA, Oct. 30 -- JFE STEEL CORPORATION filed a patent application (JP2026/002059) for “METHOD FOR EVALUATING LIQUID METAL EMBRITTLEMENT SENSITIVITY”. With publication no. WO/2026/225030, here are th... Read More