International Patent: HEAT DISSIPATION FIN, COOLING DEVICE, AND SEMICONDUCTOR DEVICE

GENEVA, Oct. 30 -- MITSUBISHI ELECTRIC CORPORATION filed a patent application (JP2026/002171) for “HEAT DISSIPATION FIN, COOLING DEVICE, AND SEMICONDUCTOR DEVICE”. With publication no. WO/2026/225034, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10W 40/30

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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