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US Patent Issued to DANA CANADA on April 7 for "Thick film printed cooler for improved thermal management of direct bonded power devices" (Canadian Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,693, issued on April 7, was assigned to DANA CANADA Corp. (Oakville, Canada). "Thick film printed cooler for improved thermal management of... और पढ़ें


US Patent Issued to VIA LABS on April 7 for "Circuit board and electronic assembly" (Taiwanese Inventor)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,694, issued on April 7, was assigned to VIA LABS INC. (New Taipei City, Taiwan). "Circuit board and electronic assembly" was invented by Sh... और पढ़ें


US Patent Issued to SEG Automotive Germany on April 7 for "Half-bridge switch arrangement" (German Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,695, issued on April 7, was assigned to SEG Automotive Germany GmbH (Stuttgart, Germany). "Half-bridge switch arrangement" was invented by ... और पढ़ें


US Patent Issued to AT&S (Chongqing) on April 7 for "Component carrier and method of manufacturing the same" (Chinese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,696, issued on April 7, was assigned to AT&S (Chongqing) Co. Ltd. (Chongqing, China). "Component carrier and method of manufacturing the sa... और पढ़ें


US Patent Issued to MURATA MANUFACTURING on April 7 for "Circuit board and multilayer circuit board" (Japanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,697, issued on April 7, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan). "Circuit board and multilayer circuit board" was inve... और पढ़ें


US Patent Issued to NITTO DENKO on April 7 for "Wiring circuit board" (Japanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,698, issued on April 7, was assigned to NITTO DENKO Corp. (Osaka, Japan). "Wiring circuit board" was invented by Yusaku Tamaki (Osaka, Japa... और पढ़ें


US Patent Issued to LOTTE ENERGY MATERIALS CORPORATON on April 7 for "Ultra-thin copper foil with carrier foil for allowing easy micro-hole processing, copper-clad laminate using same, and manufacturing method therefor" (South Korean Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,699, issued on April 7, was assigned to LOTTE ENERGY MATERIALS CORPORATON (Jeollabuk-do, South Korea). "Ultra-thin copper foil with carrier... और पढ़ें


US Patent Issued to KYOCERA on April 7 for "Wiring board" (Japanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,700, issued on April 7, was assigned to KYOCERA Corp. (Kyoto, Japan). "Wiring board" was invented by Hiroaki Sano (Kagoshima, Japan), Toshi... और पढ़ें


US Patent Issued to NANYA TECHNOLOGY on April 7 for "Semiconductor device with selection structure and method for fabricating the same" (Taiwanese Inventor)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,701, issued on April 7, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor device with selection structure an... और पढ़ें


US Patent Issued to SAMSUNG ELECTRO-MECHANICS on April 7 for "Printed circuit board" (South Korean Inventor)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,702, issued on April 7, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea). "Printed circuit board" was invented by... और पढ़ें