GENEVA, Sept. 18 -- NATIONAL UNIVERSITY CORPORATION HOKKAIDO UNIVERSITY filed a patent application (JP2026/008021) for “ANISOTROPIC STRAIN SENSOR AND METHOD FOR MANUFACTURING SAME”. With publication n... Read More
GENEVA, Sept. 18 -- NATIONAL UNIVERSITY CORPORATION HOKKAIDO UNIVERSITY filed a patent application (JP2026/008021) for “ANISOTROPIC STRAIN SENSOR AND METHOD FOR MANUFACTURING SAME”. With publication n... Read More
GENEVA, Sept. 18 -- PANASONIC AUTOMOTIVE SYSTEMS CO., LTD. filed a patent application (JP2026/008022) for “DISPLAY DEVICE AND ATTACHMENT MEMBER”. With publication no. WO/2026/186753, here are the othe... Read More
GENEVA, Sept. 18 -- PANASONIC AUTOMOTIVE SYSTEMS CO., LTD. filed a patent application (JP2026/008022) for “DISPLAY DEVICE AND ATTACHMENT MEMBER”. With publication no. WO/2026/186753, here are the othe... Read More
GENEVA, Sept. 18 -- NTN CORPORATION filed a patent application (JP2026/007993) for “ROLLING BEARING AND ROLLING COMPONENT FOR ROLLING BEARING”. With publication no. WO/2026/186747, here are the other ... Read More
GENEVA, Sept. 18 -- NTN CORPORATION filed a patent application (JP2026/007993) for “ROLLING BEARING AND ROLLING COMPONENT FOR ROLLING BEARING”. With publication no. WO/2026/186747, here are the other ... Read More
GENEVA, Sept. 18 -- DENKA COMPANY LIMITED filed a patent application (JP2026/008008) for “COMPOSITION FOR TEMPORARY FIXATION, METHOD FOR PRODUCING WAFER, AND COMPOSITION”. With publication no. WO/2026... Read More
GENEVA, Sept. 18 -- DENKA COMPANY LIMITED filed a patent application (JP2026/008008) for “COMPOSITION FOR TEMPORARY FIXATION, METHOD FOR PRODUCING WAFER, AND COMPOSITION”. With publication no. WO/2026... Read More
GENEVA, Sept. 18 -- DENKA COMPANY LIMITED filed a patent application (JP2026/008013) for “COMPOSITION FOR PROVISIONAL FIXATION, METHOD FOR PRODUCING WAFER, AND COMPOSITION”. With publication no. WO/20... Read More
GENEVA, Sept. 18 -- DENKA COMPANY LIMITED filed a patent application (JP2026/008013) for “COMPOSITION FOR PROVISIONAL FIXATION, METHOD FOR PRODUCING WAFER, AND COMPOSITION”. With publication no. WO/20... Read More