GENEVA, Sept. 18 -- DENKA COMPANY LIMITED filed a patent application (JP2026/008008) for “COMPOSITION FOR TEMPORARY FIXATION, METHOD FOR PRODUCING WAFER, AND COMPOSITION”. With publication no. WO/2026/186748, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C09J 201/00
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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