ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,965, issued on Oct. 27, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor device with slanted conductive lay... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,966, issued on Oct. 27, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China). "Multi-side power delivery in stacked memory packa... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,967, issued on Oct. 27, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.). "Element with routing structure i... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,968, issued on Oct. 27, was assigned to Intel Corp. (Santa Clara, Calif.). "Modular package architecture for voltage regulator-compute-memo... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,969, issued on Oct. 27, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea). "Display device and method of manufacturing the ... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,970, issued on Oct. 27, was assigned to Lumileds LLC (San Jose, Calif.). "Combined LED and sensor arrangement" was invented by Arjen Gerben... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,971, issued on Oct. 27, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea). "Display device including driving voltage line" ... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,972, issued on Oct. 27, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "3D semiconductor structure for wide... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,973, issued on Oct. 27, was assigned to MediaTek Inc. (Hsinchu City, Taiwan). "High-bandwidth package-on-package structure" was invented by... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,974, issued on Oct. 27, was assigned to Allegro MicroSystems LLC (Manchester, N.H.). "High voltage integrated circuit package with core" wa... Read More