ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,945, issued on Oct. 27, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Integrated circuit having improved ASML alignment marks" was inve... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,946, issued on Oct. 27, was assigned to SK hynix Inc. (Gyeonggi-do, South Korea). "Semiconductor wafer including alignment key pattern laye... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,947, issued on Oct. 27, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package with stepped redistrib... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,948, issued on Oct. 27, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package and wiring substrate i... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,949, issued on Oct. 27, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package and manufacturing meth... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,950, issued on Oct. 27, was assigned to Advanced Semiconductor Engineering Inc. (Kaohsiung, Taiwan). "Electronic package" was invented by P... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,951, issued on Oct. 27, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Package structure with connecting s... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,952, issued on Oct. 27, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor package and method of manuf... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,953, issued on Oct. 27, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package" was invented by Jae-M... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,954, issued on Oct. 27, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Shape memory polymer for use in semiconductor device fabrication"... Read More