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US Patent Issued to MURATA MANUFACTURING on June 9 for "Radio frequency module and communication device" (Japanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,076, issued on June 9, was assigned to MURATA MANUFACTURING Co. LTD. (Nagaokakyo, Japan). "Radio frequency module and communication device" ... Read More


US Patent Issued to Micron Technology on June 9 for "Semiconductor device assemblies and systems with improved thermal performance and methods for making the same" (Idaho Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,077, issued on June 9, was assigned to Micron Technology Inc. (Boise, Idaho). "Semiconductor device assemblies and systems with improved the... Read More


US Patent Issued to Intel on June 9 for "Interconnection structure with liquid metal and surface pins and removable magnet or guideposts aligment around package substrate" (Malaysian, Taiwanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,078, issued on June 9, was assigned to Intel Corp. (Santa Clara, Calif.). "Interconnection structure with liquid metal and surface pins and ... Read More


US Patent Issued to SAMSUNG ELECTRONICS on June 9 for "Method of fabricating semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,079, issued on June 9, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Method of fabricating semiconductor package" w... Read More


US Patent Issued to BOE Technology Group on June 9 for "Array substrate, display panel and electronic device" (Chinese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,652,858, issued on June 9, was assigned to BOE Technology Group Co. Ltd. (Beijing). "Array substrate, display panel and electronic device" was i... Read More


US Patent Issued to Nexperia on June 9 for "Semiconductor device and ESD protection device comprising charge carrier injection structure" (Dutch Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,652,860, issued on June 9, was assigned to Nexperia B.V. (Nijmegen, Netherlands). "Semiconductor device and ESD protection device comprising cha... Read More


US Patent Issued to STMicroelectronics France on June 9 for "Protection against electrostatic discharges" (French Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,652,861, issued on June 9, was assigned to STMicroelectronics France (Montrouge, France). "Protection against electrostatic discharges" was inve... Read More


US Patent Issued to HYUNDAI MOBIS on June 9 for "Display assembly and assembly method thereof" (South Korean Inventor)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,652,772, issued on June 9, was assigned to HYUNDAI MOBIS Co. LTD. (Seoul, South Korea). "Display assembly and assembly method thereof" was inven... Read More


US Patent Issued to Japan Aviation Electronics Industry on June 9 for "Differential transmission board set and assembly" (Japanese Inventor)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,652,773, issued on June 9, was assigned to Japan Aviation Electronics Industry Ltd. (Tokyo). "Differential transmission board set and assembly" ... Read More


US Patent Issued to BULL on June 9 for "Extension for a supercomputer rack" (French Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,652,774, issued on June 9, was assigned to BULL SAS (Les Clayes-sous-Bois, France). "Extension for a supercomputer rack" was invented by Christo... Read More