US Patent Issued to SAMSUNG ELECTRONICS on June 9 for "Method of fabricating semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,079, issued on June 9, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Method of fabricating semiconductor package" was invented by Ji-Yong Park (Suwon-si, South Korea), Jeong Hyun Lee (Suwon-si, South Korea) and Choong Bin Yim (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of fabricating a semiconductor package includes providing a semiconductor chip having solder balls formed on a bottom surface thereof, forming an adhesive layer on a top surface of the semiconductor chip, mounting the semiconductor chip on a first wafer using the solder balls, bonding a second wafer to the first wafer and to t...