ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,786, issued on Oct. 6, was assigned to GUANGDONG OPSCO TECHNOLOGY Co. LTD (Dongguan, China). "LED lighting strip" was invented by Mingjian L... Read More
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,787, issued on Oct. 6, was assigned to Seoul Viosys Co. Ltd. (Ansan-si, South Korea). "Light emitting device having a first light emitting d... Read More
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,788, issued on Oct. 6, was assigned to LG Display Co. Ltd. (Seoul, South Korea). "Display panel and display device" was invented by YuHo Jun... Read More
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,789, issued on Oct. 6, was assigned to XIAMEN SAN'AN OPTOELECTRONICS Co. LTD. (Xiamen, China). "Light emitting assembly with raised adhesive... Read More
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,790, issued on Oct. 6, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package and method of manufactur... Read More
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,791, issued on Oct. 6, was assigned to LG Display Co. Ltd. (South Korea). "Display device that self assembles light emitting diodes" was inv... Read More
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,792, issued on Oct. 6, was assigned to Qorvo US Inc. (Greensboro, N.C.). "Wafer-level hybrid bonded RF switch with redistribution layer" was... Read More
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,793, issued on Oct. 6, was assigned to Kioxia Corp. (Tokyo). "Encapsulating semiconductor chips using masks" was invented by Satoru Itakura ... Read More
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,794, issued on Oct. 6, was assigned to Infineon Technologies AG (Neubiberg, Germany). "Semiconductor module arrangement" was invented by Chr... Read More
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,795, issued on Oct. 6, was assigned to SERIPHY TECHNOLOGY Corp. (Hsinchu County, Taiwan). "Semiconductor package and method for manufacturin... Read More