ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,789, issued on Oct. 6, was assigned to XIAMEN SAN'AN OPTOELECTRONICS Co. LTD. (Xiamen, China).
"Light emitting assembly with raised adhesive layer" was invented by Tung-Kai Liu (Xiamen, China), Shao-Ying Ting (Xiamen, China), Chen-Ke Hsu (Xiamen, China) and Chia-En Lee (Xiamen, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "A light-emitting assembly with a raised adhesive layer includes a substrate, an adhesive layer, a plurality of light emitting units, and a protective layer. The adhesive layer is disposed on the substrate in a first direction. The light emitting units are disposed on the adhesive layer opposite to the substrate in the first ...