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US Patent Issued to LG Display on June 23 for "Display device" (South Korean Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,667,008, issued on June 23, was assigned to LG Display Co. Ltd. (Seoul, South Korea). "Display device" was invented by Hyowon Kwon (Suwon-si, S... Read More


US Patent Issued to Qorvo US on June 23 for "Stacked die package and methods of forming the same" (North Carolina Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,667,009, issued on June 23, was assigned to Qorvo US Inc. (Greensboro, N.C.). "Stacked die package and methods of forming the same" was invente... Read More


US Patent Issued to DYNEX SEMICONDUCTOR, ZHUZHOU CRRC TIMES SEMICONDUCTOR on June 23 for "Semiconductor device" (British Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,667,010, issued on June 23, was assigned to DYNEX SEMICONDUCTOR Ltd. (Lincoln, Great Britain) and ZHUZHOU CRRC TIMES SEMICONDUCTOR Co. LTD (Huna... Read More


US Patent Issued to Shin-Etsu Chemical on June 23 for "Advanced lift method and apparatus for transferring optical devices using laser emission and photomask techniques" (Japanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,667,011, issued on June 23, was assigned to Shin-Etsu Chemical Co. Ltd. (Tokyo). "Advanced lift method and apparatus for transferring optical d... Read More


US Patent Issued to International Business Machines on June 23 for "Clustering fine pitch micro-bumps for packaging and test" (American, German Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,667,012, issued on June 23, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Clustering fine pitch micro-bumps for packag... Read More


US Patent Issued to FOSHAN NATIONSTAR OPTOELECTRONICS on June 23 for "Device including a chipset and an anti-vulcanization film" (Chinese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,667,013, issued on June 23, was assigned to FOSHAN NATIONSTAR OPTOELECTRONICS Co. LTD. (Foshan, China). "Device including a chipset and an anti... Read More


US Patent Issued to CHANGXIN MEMORY TECHNOLOGIES on June 23 for "Package structure and packaging method" (Chinese Inventor)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,667,014, issued on June 23, was assigned to CHANGXIN MEMORY TECHNOLOGIES INC. (Hefei City, China). "Package structure and packaging method" was... Read More


US Patent Issued to Mitsubishi Electric on June 23 for "Semiconductor device with pairs of signal pads concentrated on control ic side" (Japanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,667,015, issued on June 23, was assigned to Mitsubishi Electric Corp. (Tokyo). "Semiconductor device with pairs of signal pads concentrated on ... Read More


US Patent Issued to Hue on June 23 for "Micro package structure" (Chinese Inventor)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,667,016, issued on June 23, was assigned to Hue Inc. (Shanghai). "Micro package structure" was invented by Yang Yue (Shanghai). According to t... Read More


US Patent Issued to Seoul Viosys on June 23 for "Light emitting device module and display apparatus having the same" (South Korean Inventor)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,667,017, issued on June 23, was assigned to Seoul Viosys Co. Ltd. (Gyeonggi-do, South Korea). "Light emitting device module and display apparat... Read More