US Patent Issued to Taiwan Semiconductor Manufacturing on June 9 for "Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device" (Taiwanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,074, issued on June 9, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Under-bump-metallization structure an... Read More

US Patent Issued to NANYA TECHNOLOGY on June 9 for "Semiconductor device with decoupling capacitor structure and method for manufacturing the same" (Taiwanese Inventor)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,075, issued on June 9, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor device with decoupling capacitor str... Read More

US Patent Issued to MURATA MANUFACTURING on June 9 for "Radio frequency module and communication device" (Japanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,076, issued on June 9, was assigned to MURATA MANUFACTURING Co. LTD. (Nagaokakyo, Japan). "Radio frequency module and communication device" ... Read More

US Patent Issued to Micron Technology on June 9 for "Semiconductor device assemblies and systems with improved thermal performance and methods for making the same" (Idaho Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,077, issued on June 9, was assigned to Micron Technology Inc. (Boise, Idaho). "Semiconductor device assemblies and systems with improved the... Read More

US Patent Issued to Intel on June 9 for "Interconnection structure with liquid metal and surface pins and removable magnet or guideposts aligment around package substrate" (Malaysian, Taiwanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,078, issued on June 9, was assigned to Intel Corp. (Santa Clara, Calif.). "Interconnection structure with liquid metal and surface pins and ... Read More

US Patent Issued to SAMSUNG ELECTRONICS on June 9 for "Method of fabricating semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,079, issued on June 9, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Method of fabricating semiconductor package" w... Read More

US Patent Issued to BOE Technology Group on June 9 for "Array substrate, display panel and electronic device" (Chinese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,652,858, issued on June 9, was assigned to BOE Technology Group Co. Ltd. (Beijing). "Array substrate, display panel and electronic device" was i... Read More

US Patent Issued to Nexperia on June 9 for "Semiconductor device and ESD protection device comprising charge carrier injection structure" (Dutch Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,652,860, issued on June 9, was assigned to Nexperia B.V. (Nijmegen, Netherlands). "Semiconductor device and ESD protection device comprising cha... Read More

US Patent Issued to STMicroelectronics France on June 9 for "Protection against electrostatic discharges" (French Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,652,861, issued on June 9, was assigned to STMicroelectronics France (Montrouge, France). "Protection against electrostatic discharges" was inve... Read More

US Patent Issued to HYUNDAI MOBIS on June 9 for "Display assembly and assembly method thereof" (South Korean Inventor)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,652,772, issued on June 9, was assigned to HYUNDAI MOBIS Co. LTD. (Seoul, South Korea). "Display assembly and assembly method thereof" was inven... Read More

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