ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,561,135, issued on Feb. 24, was assigned to Alipay (Hangzhou) Information Technology Co. Ltd. (Hangzhou, China). "Cross-platform plug-in develo... Read More
ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,561,779, issued on Feb. 24, was assigned to UNIVERSITY OF SOUTH CAROLINA (Columbia, S.C.). "Predicting railroad ballast fouling conditions base... Read More
ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,560,556, issued on Feb. 24, was assigned to ASML Netherlands B.V. (Veldhoven, Netherlands). "Method and system of sample edge detection and sam... Read More
ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,558,082, issued on Feb. 24, was assigned to Cilag GmbH International (Zug, Switzerland). "Cooperative access hybrid procedures" was invented by... Read More
ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,562,017, issued on Feb. 24, was assigned to Innovative Technology Ltd. (Oldham, Great Britain). "Coin apparatus" was invented by Paul Clark (Ol... Read More
ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,558,800, issued on Feb. 24, was assigned to The Board of Trustees of the Leland Stanford Junior University (Stanford, Calif.). "Devices and met... Read More
ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,558,706, issued on Feb. 24, was assigned to Aito BV (Amsterdam). "Piezoelectric user interface arrangement, and method for driving piezoelectri... Read More
ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,559,466, issued on Feb. 24, was assigned to UPL LTD (Haldia, India). "Process for preparation of intermediates" was invented by Santosh Ganpat ... Read More
ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,561,405, issued on Feb. 24, was assigned to Digital Global Systems Inc. (Tysons Corner, Va.). "Systems and methods of sensor data fusion" was i... Read More
ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,564,080, issued on Feb. 24, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Memory module having first connection bumps ... Read More