US Patent Issued to SAMSUNG ELECTRONICS on April 14 for "Film package and package module including the same" (South Korean Inventor)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,401, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Film package and package module including ... Read More

US Patent Issued to Chengdu BOE Optoelectronics Technology, BOE TECHNOLOGY GROUP on April 14 for "Display device" (Chinese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,402, issued on April 14, was assigned to Chengdu BOE Optoelectronics Technology Co. Ltd. (Chengdu, China) and BOE TECHNOLOGY GROUP Co. LTD.... Read More

US Patent Issued to Chengdu BOE Optoelectronics Technology, BOE TECHNOLOGY GROUP on April 14 for "Display device" (Chinese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,402, issued on April 14, was assigned to Chengdu BOE Optoelectronics Technology Co. Ltd. (Chengdu, China) and BOE TECHNOLOGY GROUP Co. LTD.... Read More

US Patent Issued to DENSO on April 14 for "Electronic device" (Japanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,403, issued on April 14, was assigned to DENSO Corp. (Kariya-city, Japan). "Electronic device" was invented by Hiroyoshi Kunieda (Kariya-c... Read More

US Patent Issued to DENSO on April 14 for "Electronic device" (Japanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,403, issued on April 14, was assigned to DENSO Corp. (Kariya-city, Japan). "Electronic device" was invented by Hiroyoshi Kunieda (Kariya-c... Read More

US Patent Issued to TAICANG MANAFLEX TECHNOLOGY on April 14 for "Circuit board weld structure" (Nevada Inventor)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,404, issued on April 14, was assigned to TAICANG MANAFLEX TECHNOLOGY Co. LTD. (China). "Circuit board weld structure" was invented by Robe... Read More

US Patent Issued to TAICANG MANAFLEX TECHNOLOGY on April 14 for "Circuit board weld structure" (Nevada Inventor)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,404, issued on April 14, was assigned to TAICANG MANAFLEX TECHNOLOGY Co. LTD. (China). "Circuit board weld structure" was invented by Robe... Read More

US Patent Issued to Intel on April 14 for "Mirror-core mounting multiple computer processor modules for minimized trace length" (Colorado, California Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,405, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Mirror-core mounting multiple computer processor modules for ... Read More

US Patent Issued to Intel on April 14 for "Mirror-core mounting multiple computer processor modules for minimized trace length" (Colorado, California Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,405, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Mirror-core mounting multiple computer processor modules for ... Read More

US Patent Issued to SONY GROUP on April 14 for "Multilayer electronic substrate" (Japanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,406, issued on April 14, was assigned to SONY GROUP Corp. (Tokyo). "Multilayer electronic substrate" was invented by Kanahiro Shirota (Tok... Read More

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