ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,404, issued on April 14, was assigned to TAICANG MANAFLEX TECHNOLOGY Co. LTD. (China).
"Circuit board weld structure" was invented by Robert C. Lane (Las Vegas).
According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit board weld structure comprises a first circuit board connected with and a second circuit board. A surface of the first circuit board is provided with a first covering film, the first covering film is provided with a first through hole, and a first welding pad is formed on the surface of the first circuit board. A surface of the second circuit board is provided with a second covering film, the second covering film is provided with a sec...