US Patent Issued to SAMSUNG ELECTRONICS on May 12 for "Semiconductor package and method of manufacturing the semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,707, issued on May 12, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package and method of manufactur... Read More

US Patent Issued to SAMSUNG ELECTRONICS on May 12 for "Semiconductor package and method of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,708, issued on May 12, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor package and method of manufac... Read More

US Patent Issued to SAMSUNG ELECTRONICS on May 12 for "Semiconductor package having two-dimensional input and output device" (South Korean Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,709, issued on May 12, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package having two-dimensional i... Read More

US Patent Issued to NANYA TECHNOLOGY on May 12 for "Semiconductor package and manufacturing method thereof" (Taiwanese Inventor)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,710, issued on May 12, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor package and manufacturing method the... Read More

US Patent Issued to SAMSUNG ELECTRONICS on May 12 for "Integrated circuit package, electronic device including the same, and manufacturing method thereof" (South Korean Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,711, issued on May 12, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Integrated circuit package, electronic device ... Read More

US Patent Issued to SAMSUNG ELECTRONICS on May 12 for "Semiconductor package having protrusions from redistribution wiring layer and method of manufacturing the semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,712, issued on May 12, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package having protrusions from ... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on May 12 for "Giga interposer integration through chip-on-wafer-on-substrate" (Taiwanese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,713, issued on May 12, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Giga interposer integration through c... Read More

US Patent Issued to Mitsubishi Electric on May 12 for "Semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,714, issued on May 12, was assigned to Mitsubishi Electric Corp. (Tokyo). "Semiconductor device" was invented by Naoki Ikeda (Tokyo), Kazuki... Read More

US Patent Issued to Renesas Electronics on May 12 for "Semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,715, issued on May 12, was assigned to Renesas Electronics Corp. (Tokyo). "Semiconductor device" was invented by Takamichi Hosokawa (Tokyo),... Read More

US Patent Issued to FUJI ELECTRIC on May 12 for "Semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,716, issued on May 12, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Semiconductor device" was invented by Kensuke Matsuzawa (M... Read More

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