US Patent Issued to Renesas Electronics on May 12 for "Semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,715, issued on May 12, was assigned to Renesas Electronics Corp. (Tokyo).

"Semiconductor device" was invented by Takamichi Hosokawa (Tokyo), Tatsuaki Tsukuda (Tokyo) and Yoshihiro Masumura (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes: a first chip mounting portion and a second chip mounting portion adjacent to each other in a first direction; a first semiconductor chip and a third semiconductor chip adjacent to each other in a second direction and mounted on the first chip mounting portion; and a second semiconductor chip mounted on the second chip mounting portion. The third semiconductor has: one or more fir...