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Liquid cooling becomes standard for high-end AI infrastructure, with penetration expected to reach 53% in 2026

India, Aug. 19 -- According to TrendForce's latest AI server industry research, continued investment in AI infrastructure and the rapid iteration of AI chips from NVIDIA, AMD, and Google have pushed t... Read More


HPE expands Academic Alliance to 176 Indian universities

India, Aug. 19 -- HPE has expanded its Academic Alliance Program to 176 Indian universities, reaching more than 18,000 students in 2026 through training, virtual labs and certification pathways. HPE ... Read More


UC Berkeley to join Applied Materials' EPIC Center to speed chip innovation

India, Aug. 19 -- Applied Materials Inc. announced that the University of California, Berkeley will join the company's EPIC Center in Silicon Valley as a research collaborator. Working side by side w... Read More


SEMICON India 2026: Silicon to systems: Building the ecosystem

India, Aug. 18 -- The fifth edition of SEMICON India 2026 will be officially inaugurated by Hon'ble Prime Minister . Narendra Modi on 17th September 2026 at Yashobhoomi (India International Convention... Read More


How intelligent application management is reshaping enterprise delivery models

India, Aug. 18 -- Over the past few years, enterprises have been on a relentless march towards cloud, scale, and agility. In this journey, they have built application landscapes of remarkable power bu... Read More


NVIDIA accelerating development of Feynman GPU architecture

India, Aug. 18 -- NVIDIA is accelerating the development of its next-generation "Feynman" GPU architecture by utilizing TSMC's cutting-edge A16 (1.6nm-class) process node. This move marks a major shi... Read More


Seoul Semiconductor secures permanent injunction in India following rulings in Europe and USA

India, Aug. 18 -- Seoul Semiconductor Co. Ltd and its affiliate Seoul Viosys Co. Ltd, both global opto-semiconductor technology companies, have obtained a permanent injunction enjoining infringement o... Read More


TSMC reportedly eyes two AUO fabs worth TWD 30B+ for FOPLP and CoPoS; Longtan could add 1.4nm

India, Aug. 18 -- TSMC is reportedly looking to accelerate its advanced packaging expansion by securing existing manufacturing infrastructure near its key production hubs. According to Economic Daily... Read More


BAE Systems advances to Phase 2 of DARPA's THREADS program

India, Aug. 18 -- BAE Systems' FAST Labs research, development and production organization has successfully completed Phase 1 of the Defense Advanced Research Projects Agency's (DARPA) Technologies fo... Read More


Chinese firms double down on high-end PCB, with total investment exceeding RMB 2.7bn

India, Aug. 18 -- Recently, Shenzhen MTC and Guangdong Ellington Electronics have successively advanced their presence in high-end printed circuit boards (PCBs). Focusing on key application segments ... Read More