US Patent Issued to SAMSUNG ELECTRONICS on April 14 for "Semiconductor devices" (South Korean Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,722, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor devices" was invented by San... Read More

US Patent Issued to SAMSUNG ELECTRONICS on April 14 for "Semiconductor devices" (South Korean Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,722, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor devices" was invented by San... Read More

US Patent Issued to TAIWAN SEMICONDICTOR MANUFACTURING on April 14 for "Metal capping layer for reducing gate resistance in semiconductor devices" (Taiwanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,723, issued on April 14, was assigned to TAIWAN SEMICONDICTOR MANUFACTURING COMPANY LTD (Hsinchu, Taiwan). "Metal capping layer for reduci... Read More

US Patent Issued to TAIWAN SEMICONDICTOR MANUFACTURING on April 14 for "Metal capping layer for reducing gate resistance in semiconductor devices" (Taiwanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,723, issued on April 14, was assigned to TAIWAN SEMICONDICTOR MANUFACTURING COMPANY LTD (Hsinchu, Taiwan). "Metal capping layer for reduci... Read More

US Patent Issued to SAMSUNG ELECTRONICS on April 14 for "Vertical semiconductor device" (South Korean Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,724, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Vertical semiconductor device" was invente... Read More

US Patent Issued to SAMSUNG ELECTRONICS on April 14 for "Vertical semiconductor device" (South Korean Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,724, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Vertical semiconductor device" was invente... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on April 14 for "Interlevel dielectric structure in semiconductor device" (Taiwanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,725, issued on April 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Interlevel dielectric structure i... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on April 14 for "Interlevel dielectric structure in semiconductor device" (Taiwanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,725, issued on April 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Interlevel dielectric structure i... Read More

US Patent Issued to GlobalFoundries Singapore on April 14 for "Electronic fuse" (Singaporean Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,726, issued on April 14, was assigned to GlobalFoundries Singapore Pte. Ltd. (Singapore). "Electronic fuse" was invented by Xinshu Cai (Si... Read More

US Patent Issued to GlobalFoundries Singapore on April 14 for "Electronic fuse" (Singaporean Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,726, issued on April 14, was assigned to GlobalFoundries Singapore Pte. Ltd. (Singapore). "Electronic fuse" was invented by Xinshu Cai (Si... Read More

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