US Patent Issued to Rockwell Collins on June 30 for "Packaging architecture for a high frequency active electronically scanned array" (Iowa Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,238, issued on June 30, was assigned to Rockwell Collins Inc. (Cedar Rapids, Iowa). "Packaging architecture for a high frequency active ele... Read More

US Patent Issued to Intel on June 30 for "Hybrid bonded passive integrated devices on glass core" (Arizona Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,239, issued on June 30, was assigned to Intel Corp. (Santa Clara, Calif.). "Hybrid bonded passive integrated devices on glass core" was inv... Read More

US Patent Issued to LG INNOTEK on June 30 for "Flexible printed circuit board, COF module, and electronic device comprising the same" (South Korean Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,240, issued on June 30, was assigned to LG INNOTEK Co. LTD. (Seoul, South Korea). "Flexible printed circuit board, COF module, and electron... Read More

US Patent Issued to AUTONETWORKS TECHNOLOGIES, SUMITOMO WIRING SYSTEMS, SUMITOMO ELECTRIC INDUSTRIES, SUMITOMO ELECTRIC PRINTED CIRCUITS on June 30 for "Flexible printed circuit board, wiring module, flexible printed circuit board including terminal, and power storage module" (Japanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,241, issued on June 30, was assigned to AUTONETWORKS TECHNOLOGIES LTD. (Mie, Japan), SUMITOMO WIRING SYSTEMS LTD. (Mie, Japan), SUMITOMO ELE... Read More

US Patent Issued to EAGLE TECHNOLOGY on June 30 for "Methods of manufacture of multi-diameter female contacts with a circuit board" (Florida Inventor)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,242, issued on June 30, was assigned to EAGLE TECHNOLOGY LLC (Melbourne, Fla.). "Methods of manufacture of multi-diameter female contacts w... Read More

US Patent Issued to Sumitomo Electric Industries, SUMITOMO ELECTRIC PRINTED CIRCUITS on June 30 for "Flexible printed circuit board and method of manufacturing flexible printed circuit board" (Japanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,243, issued on June 30, was assigned to Sumitomo Electric Industries Ltd. (Osaka, Japan) and SUMITOMO ELECTRIC PRINTED CIRCUITS INC. (Shiga,... Read More

US Patent Issued to DENSO International America, DENSO on June 30 for "Mount for vehicle electric control module" (Michigan Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,244, issued on June 30, was assigned to DENSO International America Inc. (South Field, Mich.) and DENSO Corp. (Japan). "Mount for vehicle e... Read More

US Patent Issued to BOE MLED Technology, BOE TECHNOLOGY GROUP on June 30 for "Display panel sub-assembly and tiled display apparatus" (Chinese Inventor)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,245, issued on June 30, was assigned to BOE MLED Technology Co. Ltd. (Beijing) and BOE TECHNOLOGY GROUP Co. LTD. (Beijing). "Display panel ... Read More

US Patent Issued to Huawei Technologies on June 30 for "Hinge mechanism and electronic device" (Chinese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,246, issued on June 30, was assigned to Huawei Technologies Co. Ltd. (Shenzhen, China). "Hinge mechanism and electronic device" was invente... Read More

US Patent Issued to Hefei BOE Joint Technology, BOE Technology Group on June 30 for "Display substrate and display device" (Chinese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,247, issued on June 30, was assigned to Hefei BOE Joint Technology Co. Ltd. (Hefei, China) and BOE Technology Group Co. Ltd. (Beijing). "Di... Read More

• ««
• «
• 80023
• 80024
• 80025
• 80026
• 80027
• 80028
• 80029
• 80030
• 80031
• 80032
• »
• »»