US Patent Issued to Intel on June 30 for "Hybrid bonded passive integrated devices on glass core" (Arizona Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,239, issued on June 30, was assigned to Intel Corp. (Santa Clara, Calif.).

"Hybrid bonded passive integrated devices on glass core" was invented by Kristof Darmawikarta (Chandler, Ariz.), Srinivas Venkata Ramanuja Pietambaram (Chandler, Ariz.), Gang Duan (Chandler, Ariz.) and Sameer Paital (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device includes a substrate including a glass core layer and first contact pads on a first surface of the glass core layer; one or more discrete passive electronic components disposed on the first surface of the glass core layer, the one or more discrete passive electronic components inc...