US Patent Issued to ROHM on May 19 for "Semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,556, issued on May 19, was assigned to ROHM Co. LTD. (Kyoto, Japan). "Semiconductor device" was invented by Koshun Saito (Kyoto, Japan). Ac... Read More

US Patent Issued to STMICROELECTRONICS on May 19 for "Sensor package including a sensor die" (Singaporean Inventor)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,557, issued on May 19, was assigned to STMICROELECTRONICS PTE LTD (Singapore). "Sensor package including a sensor die" was invented by Jing-... Read More

US Patent Issued to NUVOTON TECHNOLOGY CORPORATION JAPAN on May 19 for "Semiconductor device and mounting substrate" (Japanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,558, issued on May 19, was assigned to NUVOTON TECHNOLOGY CORPORATION JAPAN (Kyoto, Japan). "Semiconductor device and mounting substrate" wa... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on May 19 for "Semiconductor package and method of forming same" (Taiwanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,559, issued on May 19, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor package and method of f... Read More

US Patent Issued to FUJI ELECTRIC on May 19 for "Semiconductor apparatus" (Japanese Inventor)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,560, issued on May 19, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Semiconductor apparatus" was invented by Hiroki Kogawa (Ma... Read More

US Patent Issued to LG Electronics on May 19 for "Display device using micro LED and manufacturing method thereof" (South Korean Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,561, issued on May 19, was assigned to LG Electronics Inc. (Seoul, South Korea). "Display device using micro LED and manufacturing method th... Read More

US Patent Issued to Kioxia on May 19 for "Semiconductor device and semiconductor device manufacturing method" (Japanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,562, issued on May 19, was assigned to Kioxia Corp. (Tokyo). "Semiconductor device and semiconductor device manufacturing method" was invent... Read More

US Patent Issued to Samsung Display on May 19 for "Display device including connection part overlapping with light blocking pattern, and method of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,563, issued on May 19, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea). "Display device including connection part overlapp... Read More

US Patent Issued to Intel on May 19 for "Liquid metal based first level interconnects" (Arizona, Oregon Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,564, issued on May 19, was assigned to Intel Corp. (Santa Clara, Calif.). "Liquid metal based first level interconnects" was invented by Kyl... Read More

US Patent Issued to Intel on May 19 for "Semiconductor packages for alternate stacked memory and methods of manufacturing the same" (Malaysian Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,565, issued on May 19, was assigned to Intel Corp. (Santa Clara, Calif.). "Semiconductor packages for alternate stacked memory and methods o... Read More

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