US Patent Issued to NUVOTON TECHNOLOGY CORPORATION JAPAN on May 19 for "Semiconductor device and mounting substrate" (Japanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,558, issued on May 19, was assigned to NUVOTON TECHNOLOGY CORPORATION JAPAN (Kyoto, Japan).

"Semiconductor device and mounting substrate" was invented by Mitsuaki Sakamoto (Kyoto, Japan), Masao Hamasaki (Osaka, Japan), Ryouichi Ajimoto (Kyoto, Japan), Hiroshi Yoshida (Toyama, Japan) and Takashi Yui (Shiga, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes: a semiconductor layer; a vertical metal-oxide semiconductor (MOS) transistor; a protective film; a first wiring electrode connected to a source electrode of the vertical MOS transistor; and a second wiring electrode connected to a gate electrode of the vertical MO...