US Patent Issued to Intel on May 26 for "Methods and apparatus to cool electronic devices" (Indian, Taiwanese Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,641,747, issued on May 26, was assigned to Intel Corp. (Santa Clara, Calif.). "Methods and apparatus to cool electronic devices" was invented by... Read More

US Patent Issued to ICEOTOPE GROUP on May 26 for "Housing for immersive liquid cooling of multiple electronic devices" (British Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,641,748, issued on May 26, was assigned to ICEOTOPE GROUP Ltd. (South Yorkshire, Great Britain). "Housing for immersive liquid cooling of multip... Read More

US Patent Issued to Schlumberger Technology on May 26 for "High reliability, low cost electronics in oil for subsea applications" (French, British, American Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,641,749, issued on May 26, was assigned to Schlumberger Technology Corp. (Sugar Land, Texas). "High reliability, low cost electronics in oil for... Read More

US Patent Issued to NIDEC on May 26 for "Cooling unit" (Japanese Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,641,750, issued on May 26, was assigned to NIDEC Corp. (Kyoto, Japan). "Cooling unit" was invented by Takaya Okuno (Kyoto, Japan) and Takahiro I... Read More

US Patent Issued to OVH on May 26 for "Cooling block for cooling a heat-generating electronic component and method for manufacturing thereof" (French Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,641,751, issued on May 26, was assigned to OVH (Roubaix, France). "Cooling block for cooling a heat-generating electronic component and method f... Read More

US Patent Issued to Huizhou Xunshuo Technology on May 26 for "Water block with air-cooling module and multi-layer heat-conducting structure" (Chinese Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,641,752, issued on May 26, was assigned to Huizhou Xunshuo Technology Co. Ltd (Huizhou City, China). "Water block with air-cooling module and mu... Read More

US Patent Issued to LENOVO (BEIJING) on May 26 for "Water-cooled heat dissipation module, electronic device and control method thereof" (Chinese Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,641,753, issued on May 26, was assigned to LENOVO (BEIJING) Ltd. (Beijing). "Water-cooled heat dissipation module, electronic device and control... Read More

US Patent Issued to ZTE on May 26 for "Vapor chamber and electronic device" (Chinese Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,641,754, issued on May 26, was assigned to ZTE Corp. (Shenzhen, China). "Vapor chamber and electronic device" was invented by Zhen Sun (Shenzhen... Read More

US Patent Issued to JIO PLATFORMS on May 26 for "System and design method of a thermally optimized combined centralized and distributed unit" (Indian Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,641,755, issued on May 26, was assigned to JIO PLATFORMS Ltd. (Ahmedabad, India). "System and design method of a thermally optimized combined ce... Read More

US Patent Issued to SHANGHAI YOVOLE NETWORKS on May 26 for "Data-analysis-based energy-saving control method for precision air conditioner in cloud computing data center" (Chinese Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,641,756, issued on May 26, was assigned to SHANGHAI YOVOLE NETWORKS INC. (Shanghai). "Data-analysis-based energy-saving control method for preci... Read More

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