US Patent Issued to LENOVO (BEIJING) on May 26 for "Water-cooled heat dissipation module, electronic device and control method thereof" (Chinese Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,641,753, issued on May 26, was assigned to LENOVO (BEIJING) Ltd. (Beijing).

"Water-cooled heat dissipation module, electronic device and control method thereof" was invented by Bo Ding (Beijing) and Bai Lin (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "A water-cooled heat dissipation module. The water-cooled heat dissipation module includes a first heat dissipation branch for guiding a heat dissipation medium to flow in a first space; a second heat dissipation branch communicating with the first heat dissipation branch for guiding the heat dissipation medium to flow in a second space; and a control assembly for controlling a flow rate of the he...