US Patent Issued to Intel on April 14 for "Mirror-core mounting multiple computer processor modules for minimized trace length" (Colorado, California Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,405, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Mirror-core mounting multiple computer processor modules for ... Read More

US Patent Issued to Intel on April 14 for "Mirror-core mounting multiple computer processor modules for minimized trace length" (Colorado, California Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,405, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Mirror-core mounting multiple computer processor modules for ... Read More

US Patent Issued to SONY GROUP on April 14 for "Multilayer electronic substrate" (Japanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,406, issued on April 14, was assigned to SONY GROUP Corp. (Tokyo). "Multilayer electronic substrate" was invented by Kanahiro Shirota (Tok... Read More

US Patent Issued to SONY GROUP on April 14 for "Multilayer electronic substrate" (Japanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,406, issued on April 14, was assigned to SONY GROUP Corp. (Tokyo). "Multilayer electronic substrate" was invented by Kanahiro Shirota (Tok... Read More

US Patent Issued on April 14 for "Securely linked near field communication device" (California Inventor)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,407, issued on April 14. "Securely linked near field communication device" was invented by Timofey Makhlay (Marina Del Ray, Calif.). Acco... Read More

US Patent Issued on April 14 for "Securely linked near field communication device" (California Inventor)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,407, issued on April 14. "Securely linked near field communication device" was invented by Timofey Makhlay (Marina Del Ray, Calif.). Acco... Read More

US Patent Issued to DELTA ELECTRONICS on April 14 for "Circuit board module and electronic device with the same" (Taiwanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,408, issued on April 14, was assigned to DELTA ELECTRONICS INC. (Taoyuan City, Taiwan). "Circuit board module and electronic device with t... Read More

US Patent Issued to DELTA ELECTRONICS on April 14 for "Circuit board module and electronic device with the same" (Taiwanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,408, issued on April 14, was assigned to DELTA ELECTRONICS INC. (Taoyuan City, Taiwan). "Circuit board module and electronic device with t... Read More

US Patent Issued to SAMSUNG ELECTRO-MECHANICS on April 14 for "Photonic integrated circuit embedded substrate and photonic integrated circuit package" (South Korean Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,409, issued on April 14, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea). "Photonic integrated circuit embedded... Read More

US Patent Issued to SAMSUNG ELECTRO-MECHANICS on April 14 for "Photonic integrated circuit embedded substrate and photonic integrated circuit package" (South Korean Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,409, issued on April 14, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea). "Photonic integrated circuit embedded... Read More

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