US Patent Issued to SHINKO ELECTRIC INDUSTRIES on April 14 for "Method of making an interconnect substrate" (Japanese Inventor)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,395, issued on April 14, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan). "Method of making an interconnect substrate"... Read More

US Patent Issued to SHINKO ELECTRIC INDUSTRIES on April 14 for "Method of making an interconnect substrate" (Japanese Inventor)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,395, issued on April 14, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan). "Method of making an interconnect substrate"... Read More

US Patent Issued to AUO on April 14 for "Device panel" (Taiwanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,396, issued on April 14, was assigned to AUO Corp. (Hsinchu City, Taiwan). "Device panel" was invented by Zih-Shuo Huang (Hsinchu, Taiwan)... Read More

US Patent Issued to AUO on April 14 for "Device panel" (Taiwanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,396, issued on April 14, was assigned to AUO Corp. (Hsinchu City, Taiwan). "Device panel" was invented by Zih-Shuo Huang (Hsinchu, Taiwan)... Read More

US Patent Issued to CANATU on April 14 for "Method of manufacturing a formed film" (Finnish Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,397, issued on April 14, was assigned to CANATU OY (Vantaa, Finland). "Method of manufacturing a formed film" was invented by Ilkka Varjos... Read More

US Patent Issued to CANATU on April 14 for "Method of manufacturing a formed film" (Finnish Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,397, issued on April 14, was assigned to CANATU OY (Vantaa, Finland). "Method of manufacturing a formed film" was invented by Ilkka Varjos... Read More

US Patent Issued to The Regents of the University of Colorado, a body corporate on April 14 for "Self-healable, recyclable, and reconfigurable wearable electronics device" (Colorado Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,398, issued on April 14, was assigned to The Regents of the University of Colorado, a body corporate (Denver). "Self-healable, recyclable,... Read More

US Patent Issued to The Regents of the University of Colorado, a body corporate on April 14 for "Self-healable, recyclable, and reconfigurable wearable electronics device" (Colorado Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,398, issued on April 14, was assigned to The Regents of the University of Colorado, a body corporate (Denver). "Self-healable, recyclable,... Read More

US Patent Issued to Sumitomo Electric Industries on April 14 for "Substrate for printed wiring board and printed wiring board" (Japanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,399, issued on April 14, was assigned to Sumitomo Electric Industries Ltd. (Osaka, Japan). "Substrate for printed wiring board and printed... Read More

US Patent Issued to Sumitomo Electric Industries on April 14 for "Substrate for printed wiring board and printed wiring board" (Japanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,399, issued on April 14, was assigned to Sumitomo Electric Industries Ltd. (Osaka, Japan). "Substrate for printed wiring board and printed... Read More

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