US Patent Issued to Murata Manufacturing on April 21 for "Electronic component and method for forming resin layer on electronic component" (Japanese Inventor)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,848, issued on April 21, was assigned to Murata Manufacturing Co. Ltd. (Kyoto, Japan). "Electronic component and method for forming resin ... Read More

US Patent Issued to PANJIT INTERNATIONAL on April 21 for "Semiconductor packaging structure" (Taiwanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,849, issued on April 21, was assigned to PANJIT INTERNATIONAL INC. (Kaohsiung City, Taiwan). "Semiconductor packaging structure" was inven... Read More

US Patent Issued to SAMSUNG ELECTRONICS on April 21 for "Semiconductor package and method for manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,850, issued on April 21, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package and method for manuf... Read More

US Patent Issued to STATS ChipPAC on April 21 for "Semiconductor device and method of making a dual-side molded system-in-package with fine-pitched interconnects" (South Korean Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,851, issued on April 21, was assigned to STATS ChipPAC Pte. Ltd. (Singapore). "Semiconductor device and method of making a dual-side molde... Read More

US Patent Issued to Huawei Technologies'Co., 'Ltd.' on April 21 for "Switching power module and communications device" (Chinese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,852, issued on April 21, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China). "Switching power module and communications devic... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on April 21 for "Semiconductor device structure with bonding pad and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,854, issued on April 21, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor device structur... Read More

US Patent Issued to Samsung Display on April 21 for "Display device" (South Korean Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,855, issued on April 21, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea). "Display device" was invented by Jun Yong Kim ... Read More

US Patent Issued to KIOXIA on April 21 for "Semiconductor device and method for manufacturing semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,856, issued on April 21, was assigned to KIOXIA Corp. (Tokyo). "Semiconductor device and method for manufacturing semiconductor device" wa... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on April 21 for "In-memory computing circuit and fabrication method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,857, issued on April 21, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "In-memory computing circuit and f... Read More

US Patent Issued to SEOUL VIOSYS on April 21 for "Light emitting module and display apparatus having the same" (South Korean Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,858, issued on April 21, was assigned to SEOUL VIOSYS Co. LTD. (Ansan-si, South Korea). "Light emitting module and display apparatus havin... Read More

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