US Patent Issued to NANYA TECHNOLOGY on April 21 for "Manufacturing method of semiconductor device" (Taiwanese Inventor)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,765, issued on April 21, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Manufacturing method of semiconductor device" ... Read More

US Patent Issued to NANYA TECHNOLOGY on April 21 for "Method of patterning a semiconductor structure" (Taiwanese Inventor)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,766, issued on April 21, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Method of patterning a semiconductor structure... Read More

US Patent Issued to Wolfspeed on April 21 for "Additives for grinding semiconductor workpieces" (North Carolina Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,767, issued on April 21, was assigned to Wolfspeed Inc. (Durham, N.C.). "Additives for grinding semiconductor workpieces" was invented by ... Read More

US Patent Issued to SAMSUNG ELECTRONICS on April 21 for "Method of processing a substrate" (South Korean Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,768, issued on April 21, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Method of processing a substrate" was inve... Read More

US Patent Issued to DISCO on April 21 for "Processing method" (Japanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,769, issued on April 21, was assigned to DISCO Corp. (Tokyo). "Processing method" was invented by Naoko Yamamoto (Tokyo) and Tomoaki Sugiy... Read More

US Patent Issued to SCREEN Holdings on April 21 for "Substrate processing system and substrate processing method" (Japanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,770, issued on April 21, was assigned to SCREEN Holdings Co. Ltd. (Kyoto, Japan). "Substrate processing system and substrate processing me... Read More

US Patent Issued to siconnex customized solutions on April 21 for "Treatment device and method for the treatment of semiconductor objects" (Austrian Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,771, issued on April 21, was assigned to siconnex customized solutions GmbH (Hof bei Salzburg, Austria). "Treatment device and method for ... Read More

US Patent Issued to SAMSUNG ELECTRONICS on April 21 for "Substrate processing apparatus, substrate processing method and method of fabricating semiconductor device" (South Korean Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,772, issued on April 21, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Substrate processing apparatus, substrate ... Read More

US Patent Issued to LAM RESEARCH on April 21 for "Systems and methods for metastable activated radical selective strip and etch using dual plenum showerhead" (California Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,773, issued on April 21, was assigned to LAM RESEARCH Corp. (Fremont, Calif.). "Systems and methods for metastable activated radical selec... Read More

US Patent Issued to CENTER FOR ADVANCED META-MATERIALS on April 21 for "Non-rigid pad for device transfer, method for manufacturing non-rigid pad for device transfer, and non-rigid pad group for device transfer comprising non-rigid pad for device transfer" (South Korean Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,774, issued on April 21, was assigned to CENTER FOR ADVANCED META-MATERIALS (Daejeon, South Korea). "Non-rigid pad for device transfer, me... Read More

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