US Patent Issued to Zhuhai ACCESS Semiconductor on Oct. 27 for "Substrate manufacturing method for an embedded substrate having a device adhering area" (Chinese Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,904, issued on Oct. 27, was assigned to Zhuhai ACCESS Semiconductor Co. LTD. (Zhuhai City, China).

"Substrate manufacturing method for an embedded substrate having a device adhering area" was invented by Xianming Chen (Zhuhai City, China), Gao Huang (Zhuhai City, China), Wenjian Lin (Zhuhai City, China), Yejie Hong (Zhuhai City, China), Benxia Huang (Zhuhai City, China) and Juchen Huang (Zhuhai City, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate manufacturing method, an embedded substrate and a semiconductor are disclosed. The method includes: manufacturing a first semi-finished substrate including first circuit layers and a first...