US Patent Issued to Zhuhai ACCESS Semiconductor on May 13 for "Temporary carrier and method for manufacturing coreless substrate thereby" (Chinese Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,302,508, issued on May 13, was assigned to Zhuhai ACCESS Semiconductor Co. Ltd (Guangdong, China).

"Temporary carrier and method for manufacturing coreless substrate thereby" was invented by Xianming Chen (Guangdong, China), Jian Peng (Guangdong, China), Jida Zhang (Guangdong, China), Benxia Huang (Guangdong, China), Lei Feng (Guangdong, China), Bingsen Xie (Guangdong, China) and Jun Gao (Guangdong, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A temporary carrier according to an embodiment of the present invention may include a core layer, a first Cu foil layer and a second Cu foil layer on surfaces of both sides of the core layer. Each of the f...