US Patent Issued to Zhuhai ACCESS Semiconductor on March 24 for "Embedded flip chip package substrate and manufacturing method thereof" (Chinese Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,543, issued on March 24, was assigned to Zhuhai ACCESS Semiconductor Co. Ltd (Guangdong, China).

"Embedded flip chip package substrate and manufacturing method thereof" was invented by Xianming Chen (Guangdong, China), Wenjian Lin (Guangdong, China), Gao Huang (Guangdong, China) and Benxia Huang (Guangdong, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A manufacturing method for an embedded flip chip package substrate includes laminating a first dielectric layer on the first line layer formed on a carrier plate, forming a first window on the first dielectric layer, filling a first copper post in the first window, forming a second window on t...