US Patent Issued to Zhuhai ACCESS Semiconductor on Jan. 20 for "Package substrate based on molding process and manufacturing method thereof" (Chinese Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,769, issued on Jan. 20, was assigned to Zhuhai ACCESS Semiconductor Co. Ltd (Guangdong, China).

"Package substrate based on molding process and manufacturing method thereof" was invented by Xianming Chen (Guangdong, China), Lei Feng (Guangdong, China), Benxia Huang (Guangdong, China) and Yejie Hong (Guangdong, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package substrate based on a molding process may include an encapsulation layer, a support frame located in the encapsulation layer, a base, a device located on an upper surface of the base, a copper boss located on a lower surface of the base, a conductive copper pillar layer penetrating ...