US Patent Issued to ZHEJIANG UNIVERSITY on July 28 for "Low-density liquid-phase chip for Gossypium hirsutum l. based on targeted capture sequencing and use thereof" (Chinese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,692,556, issued on July 28, was assigned to ZHEJIANG UNIVERSITY (Hangzhou, China).

"Low-density liquid-phase chip for Gossypium hirsutum l. based on targeted capture sequencing and use thereof" was invented by Zhanfeng Si (Hangzhou, China), Yan Hu (Hangzhou, China), Tianzhen Zhang (Hangzhou, China), Lei Fang (Hangzhou, China) and Zegang Han (Hangzhou, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A low-density liquid-phase chip for Gossypium hirsutum L. based on targeted capture sequencing and use thereof provided. The low-density chip includes 908 SNP loci, where among the 908 SNP loci, 329 loci are significantly related to important agronomic t...