US Patent Issued to ZHEJIANG UNIVERSITY, JCET GROUP on Feb. 24 for "Magnetic coupling-based inter-chip wireless communication interface structure and method for three-dimensional stacked chips" (Chinese Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,562,772, issued on Feb. 24, was assigned to ZHEJIANG UNIVERSITY (Zhejiang, China) and JCET GROUP Co. LTD. (Jiangsu, China).

"Magnetic coupling-based inter-chip wireless communication interface structure and method for three-dimensional stacked chips" was invented by Xiaolei Zhu (Hangzhou, China), Chonghui Sun (Hangzhou, China), Kun Yang (Hangzhou, China), Rushuo Tao (Hangzhou, China) and Cheng Yang (Wuxi, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are a magnetic coupling-based inter-chip wireless communication interface structure and method for three-dimensional stacked chips. The interface structure includes a master chip and at lea...