US Patent Issued to Yield Engineering Systems on Feb. 17 for "Solder reflow with optical endpoint control" (American, Indian Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,586, issued on Feb. 17, was assigned to Yield Engineering Systems Inc. (Fremont, Calif.).

"Solder reflow with optical endpoint control" was invented by Sandeep R. Koppikar (Karnataka, India), John Lewis (Fremont, Calif.), Vladimir Kudriavtsev (Palo Alto, Calif.) and Saket Chadda (Fremont, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A solder reflow system that includes a vacuum chamber and a sample chuck in the vacuum chamber to support a semiconductor wafer to be processed. The solder reflow system further include a heating element coupled to the vacuum chamber and configured to heat the semiconductor wafer, a thermocouple connected to the...