US Patent Issued to Yibu Semiconductor on Dec. 16 for "Semiconductor packaging method, semiconductor assembly and electronic device comprising semiconductor assembly" (Chinese Inventor)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,203, issued on Dec. 16, was assigned to Yibu Semiconductor Co. Ltd. (Shanghai).

"Semiconductor packaging method, semiconductor assembly and electronic device comprising semiconductor assembly" was invented by Weiping Li (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor packaging method, a semiconductor assembly and an electronic device are disclosed herein. The semiconductor packaging method comprises forming a first-level assembly, including: align and fix at least one first-level device to a target position on a carrier plate by utilizing the self-alignment capability of first-level alignment solder joints; encapsulating the...