US Patent Issued to YCCHEM on July 14 for "Slurry composition for final polishing of silicon wafer for reducing number of surface defects and haze and final polishing method using same" (South Korean Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,679,999, issued on July 14, was assigned to YCCHEM Co. LTD (Gyeongsangbuk-Do, South Korea).

"Slurry composition for final polishing of silicon wafer for reducing number of surface defects and haze and final polishing method using same" was invented by Jun Han Kim (Daegu, South Korea), Seung Hun Lee (Daegu, South Korea) and Seung Hyun Lee (Daegu, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to: a slurry composition for final polishing of a silicon wafer, which reduces haze and the number of defects in the surface of an object to be polished and has excellent performance; and a final polishing method using same,...