US Patent Issued to Yazaki on Oct. 6 for "Temperature sensor and temperature sensor assembly" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,754,078, issued on Oct. 6, was assigned to Yazaki Corp. (Tokyo).

"Temperature sensor and temperature sensor assembly" was invented by Tomohiro Matsushima (Makinohara, Japan) and Kenta Tanaka (Makinohara, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A temperature sensor is integrated to a case to form a busbar module. The temperature sensor includes an FPC, a chip thermistor mounted on the FPC via surface mounting, a metallic heat receiving component configured to come into contact with an upper surface of a battery cell, and an elastic element integrated to the heat receiving component with the FPC interposed between the elastic element and the h...