US Patent Issued to YAZAKI on June 30 for "Temperature sensor assembly" (Japanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,669,383, issued on June 30, was assigned to YAZAKI Corp. (Tokyo).

"Temperature sensor assembly" was invented by Tomohiro Matsushima (Makinohara, Japan) and Kenta Tanaka (Makinohara, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A temperature sensor includes an FPC, a surface-mounted chip thermistor on the FPC, a metallic heat receiving component for contact with a cell upper surface, and an elastic element integrated to the heat receiving component. The case includes a facing wall and standing walls and, the facing wall facing the cell upper surface, wherein the standing walls and extend from the facing wall toward a plate portion of the elastic ...