US Patent Issued to Yangtze Memory Technologies on May 19 for "Chip package structures, manufacturing methods thereof and electronic devices" (Chinese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,579, issued on May 19, was assigned to Yangtze Memory Technologies Co. Ltd. (Wuhan, China).

"Chip package structures, manufacturing methods thereof and electronic devices" was invented by Peng Liu (Hubei, China) and Baohua Zhang (Hubei, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "In one example, the disclosed semiconductor structure includes a package substrate, a first chip, a conductive pillar and a second chip, wherein the package substrate has a first surface; the first chip is located on the first surface of the package substrate and electrically connected to the package substrate; the conductive pillar is located on the first surface o...